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Jonkin Silicon

Technology & Manufacturing

Technology & Manufacturing

Large-Diameter Crystal Technology

Large-Diameter Crystal Technology

CZ growth of large-diameter monocrystalline silicon, with process control for crystal dimensions, conductivity type and resistivity.

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Material Forming

Material Forming

Define machining allowances against component drawings. Sizing, cropping and coring create silicon ingots, cylinders and rings.

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Precision Machining

Precision Machining

Cutting, grinding and precision machining address critical dimensions, tolerances and surface condition. Delivery requirements follow the technical agreement.

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Material Inspection

Material Inspection

Define test items and acceptance criteria for material properties, critical dimensions and surface condition, then inspect under the technical agreement.

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Packaging & Delivery

Packaging & Delivery

Arrange cleaning, protection, packaging and identification according to the material form and transport needs, with the required delivery documents.

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硅材料技术视觉

Manufacturing Large-Diameter Monocrystalline Silicon

Jonkin Silicon focuses on large-diameter silicon for semiconductor etching, with a technical process spanning crystal growth, cutting, grinding and precision machining.

Manufacturing Process

Crystal growth

CZ growth is used for monocrystalline silicon. Confirm diameter, conductivity type, resistivity range, and oxygen and carbon requirements to establish the material basis for downstream machining.

Sizing and forming

Allow for subsequent operations when sizing and cropping ingots to the required dimensions. Solid ingots may be delivered as such or proceed to coring.

Coring and cutting

Core ingots into cylinders and cut them to the target thickness to make ring blanks. Confirm diameters, wall thickness and cutting allowances together with finishing requirements.

Precision machining

Grind and precision-machine to component drawings, controlling dimensional tolerance, flatness and roughness separately. Drawings must distinguish ordinary machined surfaces from polished surfaces.

Inspection and packaging

Inspect dimensions, electrical properties, surface condition and appearance under the technical agreement. Confirm documents and packaging, using the agreed acceptance criteria for blanks and finished parts.

Process Development & Technical Progress

440 mm crystal growth and recharging trials were completed in 2025. Development continued in 2026 with a 36-inch hot zone and 600 mm diameter products.

硅材料技术视觉

Crystals & Production Facilities

单晶硅毛坯生产现场 01

Crystals and production facilities

单晶硅毛坯生产现场 02

Crystal appearance

单晶硅晶体毛坯

Crystal form

单晶硅毛坯生产现场 04

Production facilities

Technical Consultation & Custom Requirements

Please provide the product form, drawings, conductivity type, resistivity and delivery requirements.