Define test items and acceptance criteria for material properties, critical dimensions and surface condition, then inspect under the technical agreement.
Jonkin Silicon focuses on large-diameter silicon for semiconductor etching, with a technical process spanning crystal growth, cutting, grinding and precision machining.
Manufacturing Process
Crystal growth
CZ growth is used for monocrystalline silicon. Confirm diameter, conductivity type, resistivity range, and oxygen and carbon requirements to establish the material basis for downstream machining.
Sizing and forming
Allow for subsequent operations when sizing and cropping ingots to the required dimensions. Solid ingots may be delivered as such or proceed to coring.
Coring and cutting
Core ingots into cylinders and cut them to the target thickness to make ring blanks. Confirm diameters, wall thickness and cutting allowances together with finishing requirements.
Precision machining
Grind and precision-machine to component drawings, controlling dimensional tolerance, flatness and roughness separately. Drawings must distinguish ordinary machined surfaces from polished surfaces.
Inspection and packaging
Inspect dimensions, electrical properties, surface condition and appearance under the technical agreement. Confirm documents and packaging, using the agreed acceptance criteria for blanks and finished parts.
Process Development & Technical Progress
440 mm crystal growth and recharging trials were completed in 2025. Development continued in 2026 with a 36-inch hot zone and 600 mm diameter products.
Crystals & Production Facilities
Crystals and production facilities
Crystal appearance
Crystal form
Production facilities
Technical Consultation & Custom Requirements
Please provide the product form, drawings, conductivity type, resistivity and delivery requirements.